Technology

Probe the 4th Industrial Revolution.
It’s SOULBRAINSLD.

SOULBRAINSLD MEMS Div.

Technology

What is MEMS ?

MEMS is an abbreviation of Micro Electro Mechanical Systems, which is called microelectromechanical system and microelectronic control technology, and refers to micron (㎛) or ㎜-size micro-precision machine manufacturing technology based on semiconductor process technology.

It is a technology to make ultra-fine mechanical structures such as ultra-high-density integrated circuits, ultra-small gears with half the thickness of hair, and hard disks with the size of nails by processing silicon, crystal, and glass. This technology is being used in a variety of fields, from electronics and information communication to biotechnology, automobiles, and aviation.

The probe beam and tip, which is the contactor part of the probe card manufactured by our company, are made using MEMS process. This has the advantage of improving electrical performance by minimizing the distance from the PCB to the wafer DUT, and is used as an optimal solution for memory device testing that requires testing multiple wafer chips at the same time.

Our company manufactures MEMS probe cards by producing 3D MEMS probe pins in the MEMS Fab. We extended our fab and relocated to Paju City, Gyeonggi-do in 2017. The manufacturing process is as follows.

  • Photo-Lithography

  • Etching

  • Electro-plating

  • CMP
    (Chemical Mechanical
    Polishing)

Probe Card Manufacturing Process

We are a probe card manufacturer with design capabilities and MEMS probe manufacturing facilities. There is a circuit design and mechanism design team in-house to conduct basic circuit and mechanical analysis and product design necessary for product manufacturing. We also manufacture MEMS probes in-house through the MEMS FAB process.

Soulbrain SLD, which implements the entire process required for probe card manufacturing, from circuit/mechanical design, to MEMS tip manufacturing, and assembly & test, with its own technology, provides test solutions for memory devices beyond Korea.

  • Design
    (Mechanical design,
    Circuit design)

  • MPH & PCB
    Mfg.

  • Probe tip /
    beam Mfg,

  • Assembly & Test

  • QC