Product

Probe the 4th Industrial Revolution.
It’s SOULBRAINSLD.

SOULBRAINSLD MEMS Div.

Probe card for Memory Devices

Item Specification Remark (12” FWC)
Tip Size Under 12㎛ Meet customer requirement
Tip Height 175㎛  
Scrub mark length 15㎛ ± 30% at OD 75㎛ KOZ 5㎛
Path Resistance Power / GND 1Ω Current source: 50mA
Signal 10Ω
Leakage 10nA (5V) ProbeWorx or equivalent
X , Y Alignment ± 12㎛
Planarity ≤ 30㎛
Operating Chuck Temperature - 40℃, 125℃ Tip position offset is applied to each
operating temperature option.
Max Overdrive 120㎛  

  • Use 3D MEMS probes

  • Implement accurate probe tip position

  • Design low probe force in order not to damage the IC structure inside the pad

  • Apply ultra high channel sharing technology

  • Pin counts increase according to DUT increase

  • Meet wide temperature range (-40, 125C)

  • Low voltage power test